Reliability of Electronic Devices: Past, Present and Future

Date & TIme: 
03/03/2017 - 3:00pm - 4:00pm
Speaker: 
Dr. Cemal Basaran
Affiliation: 
University at Buffalo, SUNY
Location: 
Discovery Park D206B
Host Department: 
Mechanical and Energy Engineering
Abstract: 

Insatiate demand for smaller and faster electronics with more functionality, led to more complex failure modes, from simple thermal fatigue to electromigration and thermomigration due to high current density. Electro-Thermo-Mechanical-Chemical driving force induced mass transport is a major reliability concern for the present electronics. The trend in flip-chip packaging to increase I/O count drives the interconnecting solder joints to be smaller in size and, thus, carry higher current density. The current density increases further as chip voltage decrease and absolute current levels increase. Traditional metals and semi-conductors cannot meet the frequency spectrum, high current density and high temperature requirements of the next generation electronics. All metals are susceptible to electromigration and thermomigration at high current density levels and/ or high temperature gradients. Moreover traditional metals’ and semiconductors’ high temperature operational capacity is very limited. As a result, for next generation electronics there is a strong effort to replace traditional metals and semiconductors with covalent bonded 2-D nano materials, like Single Walled Carbon Nano Tube (SWCNT) and Graphene Nano Ribbon. These covalent bond materials have much superior properties compared to traditional electronic materials. The fact that Graphene and Carbon Nano Tube can be metallic and semi-conductor, it would also solve many problems faced with heterogeneous integration in an electronic device. In this presentation, computational and experimental studies conducted on reliability of past, present and future electronic devices will be discussed.

Biography: 

Dr. Cemal Basaran is a Professor and the Director of Electronic Packaging Laboratory at the State University of New York at Buffalo. He specializes in computational and experimental reliability of power and nano electronics devices. He has authored 135 + peer reviewed archival journal publications and 200+ conference papers, and presentations. He has authored 3 book chapters in the fields of damage mechanics. His research includes but not limited to graphene, carbon nano tube based power and nano electronics, electromigration, thermomigration, thermo-electro-mechanical-chemical induced fatigue, and nano-resolution high sensitivity moirĂ© interferometry. Some of his awards include 1997 US Navy ONR Young Investigator Award, and 2011 ASME EPPD Excellence in Mechanics Award. He is a Fellow of the ASME. He served and continues to serve on editorial board of 13 peer reviewed international journals, such as, IEEE Components, Packaging and Manufacturing Tech, ASME Journal of Electronic Packaging, ASCE Journal of Nanomechanics and Micromechanics, as well as numerous other journals. He has been the primary dissertation advisor to 24 PhD students. His research has been funded by NSF, ONR, DoD, State of New York, and many industrial sponsors. He serves as advisor to many national and international research funding agencies around the globe, as well as a consultant to many companies. He received his MS from Massachusetts Institute of Technology and PhD from University of Arizona.

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