Electronic Device Reliability

Our efforts in electronic device reliability are based on

With the increased needs of analog device reliability and transfer of captured energy in outdoor environments requiring more of the polymer encapsulants, the department has a high impact team focused on aspects affecting reliability.

  • High voltage, Thermal conductivity, high voltage, high dielectric strength packaging: Choi and D’Souza
  • Solar microinverter modeling and reliability: Fortier and D’Souza
  • Device failure detection : Mihai
  • Lithium battery, Thin films and Lead Free solder reliability: Fortier
  • Impact response and failure analysis: Nie

Faculty Participants: Nandika D'Souza, Aleksandra Fortier, Mihai Burzo, Tae-Youl Choi, Xu Nie

Electronic Device Reliability

Electronic Device Reliability

D’Souza and Choi are evaluating the reliability of high voltage, high thermal conductivity and high dielectric strength nanostructured polymer encapsulants using techniques such as thermally stimulated depolarization current.

Grants
  • D'Souza, Tae-Youl Choi, High thermal conductivity/high electric insulation polymers, Semiconductor Research Corporation $240,000, 1/1/2013- 12/31/2015
  • D'Souza, Electrical Performance Characterization of Molding Compounds Used in High Voltage Applications, Semiconductor Research Corporation $240,000, 2/1/2012- 1/31/2015
  • D'Souza, Fortier, Solar micro inverter modeling and reliability, Solarbridge technologies/DOE, Pending
Publications
  1. N. A. D’Souza  and Aruna Nagarur, Polymers for Electronics and Photonics,  chapter in Performance of Plastics, W. Brostow, Ed., Hanser, Munich - New York (2001).
  2. A. Fortier, M.D. Chan, X. Nie, D. Bhate, W. Chen, G. Pecht, “Comparative StudySubbarayan, I. Dutta, “Intermediate and High Strain Rate Behavior of Metal FilmsSn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys: Constitutive Models and Their Affinity for Metal Whiskers Growth",Demonstration”. IEEE Transactions on ElectronicsComponents, Packaging, and Manufacturing, (Published Vol. 2, No. 5, pp. 739) May 2012
  3. D. Chan, X. Nie, D. Bhate, W. Chen, G. Subbarayan, I. Dutta, “Intermediate and High Strain Rate Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys: Constitutive Models and Their Demonstration. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 3, 133-146, 2013
  4. A.Dimitrovska (Fortier maiden dame), R.Kovacevic, “Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating”, Journal of Electronic Materials, (Published Volume 38, Issue 12, Page 2516), December, 2009.
  5. A.Dimitrovska  (Fortier maiden dame), R.Kovacevic, “The Effect of Micro-alloying of Sn Plating on Mitigation of Sn Whisker Growth”, Journal of Electronic Materials, (Published Volume 38, Issue 12, Page 2726), December, 2009.
  6. Shrestha, R., Lee, K. M., Chang, W. S., Kim, D. S., Rhee, G. H., and T. Y. Choi, “Steady heat conduction-based thermal conductivity measurement of single walled carbon nanotubes thin film using a micropipette thermal sensor,” Review of Scientific Instruments ( Technology, 3, 133-146, 2013)
Partnerships
  • D’Souza has extensive engagements on sensor textiles and non-contact measurement approaches with Electrical Engineering (Kamesh Namuduri) and Chemistry (Francis D’Souza) on molecular imprinting.
  • Aleksandra Fortier collaborates with Michael Pecht, Center for Advanced Life Cycle Engineering Center at University of Maryland
  • Tae Youl Choi has extensive collaborations with Prof. Dongsik Kim at POSTECH in Korea
Industries working with MEE
  • Texas Instruments
  • Solarbridge Technologies
  • DfR Solutions